Apple-Compatible Open-Fit Wireless Earphones

Qhib- haum lub mloog pob ntseg uas muaj lub ntsej muag uas tsis yog- pob ntseg cuam tshuam -nqus architecture tsim los rau lub xov tooj ntawm tes, cov neeg siv khoom siv hluav taws xob, thiab OEM / ODM cov neeg yuav khoom. Tus tsim integrates directional suab kis tau tus mob thaum tuav ib tug qhib pob ntseg kwj dej rau ambient paub. Lub hardware platform txhawb kev cai firmware, xim txuam, thiab ntiag tug -label ntim.

 

 

Specification	Paub meej
Bluetooth Chipset	Airoha / Bluetrum mainstream low -latency SoC (Bluetooth 5.3)
Acoustic Tsav Tsheb	16.2 hli dynamic tsav tsheb nrog TPU composite diaphragm
Directional Audio	Acoustic beamforming architecture tsim los mloog suab nthwv dej mus rau pob ntseg kwj dej
Microphone Configuration	Dual -mic ENC (Environmental Noise Cancellation) rau lub suab hu
Roj teeb muaj peev xwm	50 mAh rau ib lub pob ntseg / 500 mAh them rooj plaub
Sijhawm Playback	Txog li 7 teev ib zaug / 28 teev tag nrho nrog cov ntaub ntawv them nyiaj (kuaj ntawm 50% ntim)
Kev them nyiaj yug interface	USB hom-C (txhawb them ceev: 10 feeb them rau 2 teev rov qab)
Kev tiv thaiv Ingress	IPX5 hws thiab dej tsis kam
Kev Ua Raws Cai	CE, FCC, RoHS, REACH, BQB Bluetooth SIG

 

 

Qhib- Pob ntseg Ergonomics:Tshaj tawm qhov hnyav thoob plaws qhov kev tiv thaiv -helix nkhaus kom txo tau hauv - pob ntseg pob ntseg thaum hnav ntev.

Leakage-Suppression Design:Ntxiv rau qhov rov qab- suab- wave chamber qauv coj mus rau lub pob ntseg.

Apple Ecosystem Integration:Ua nrog cov qauv kev sib koom ua ke, cov xwm txheej roj teeb pop-nce synchronization, thiab qis-latency suab sync rau iOS thiab macOS li.

Dual -Mic ENC Algorithm:Siv cov teeb liab ua tiav (DSP) los lim cov suab nrov tom qab thaum lub suab sib txuas lus.

RF Stability:Khaws cov kis tau tus mob mus txog 15 meters raws li tus qauv kev ua haujlwm.

 

 

 

 

Firmware Customization:Custom boot logos, pairing names, kov-tswj remapping, thiab EQ profile tuning.

Industrial Design & Tooling:Prototyping ceev ceev thiab kev cai yas txhaj tshuaj molding (ABS / PC cov ntaub ntawv, matte los yog rubberized UV tiav). Cov qauv prototyping nrawm xa tuaj hauv 7 hnub ua haujlwm.

SKU qhov sib txawv:Flexible PCB layout kev hloov kho rau kev sib koom ua ke tshwj xeeb sensor modules raws li kev thov.

MOQ qauv:Tsawg nkag mus rau qhov kev txiav txim mus sib hais, scaling mus rau siab - ntim automated ntau lawm kab.

 

 

Chaw tsim khoom:5,000 square metres plua plav-SMT dawb thiab cov khoom sib dhos ua haujlwm los ntawm 120 tus kws tshaj lij.

Cov Khoom Siv Core:Yamaha siab -SMT qhov chaw tso cov kab, AOI (Automated Optical Inspection) systems, thiab Kemo electro-acoustic test chambers.

QC Milestones:

• Incoming Material Inspection (IQC):100% kuaj cov roj teeb nyoos, chips, thiab lub suab coils.
• SMT & PCBA Kev Xeem:ICT (Nyob rau hauv -Circuit Test) thiab kev tshuaj ntsuam xyuas ua haujlwm.
• Cov Khoom Muag Ua tiav (FQA):4-point acoustic zaus teb cheb, Bluetooth RF teeb liab lub zog calibration, thiab poob xeem (1.2m pob zeb nto).
• Kev tswj tus nqi tsis zoo:Khaws qis dua 0.25% los ntawm kev tswj xyuas cov txheej txheem txheeb cais (SPC).

 

 

Standard Ntim:Recycled cardboard master carton uas muaj 50 units, ib leeg muab ntim rau hauv cov plua plav-cov ntaub ntawv pov thawj lub thawv nrog EVA sab hauv tais.

Carton Dimensions:480 x 320 x 280 mm (Qhov hnyav tag nrho: kwv yees li 11.5 kg ib lub thawv).

Kev them nyiaj yug Logistics:Palletized freight npaj, fumigation-cov ntaub ntoo dawb, thiab xa ncaj qha- cov ntaub ntawv xa khoom (MSDS, UN38.3 cov ntawv xeem rau huab cua thiab hiav txwv freight ua raws).

 

 

 

 

Xa koj cov kev qhia tshwj xeeb, lub hom phiaj ntim, thiab ntim khoom kom tau txais cov lus qhia dav dav hauv 24 teev.
[Thov ib qho OEM / ODM Quote]
Muaj kev ua haujlwm tom ntej:Tsim ib daim ntawv rub tawm DOCX ntawm no hauv kev sib tham no uas muaj cov lus hais saum toj saud

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